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Chip Foundry Services
 

Chip Foundry


Pluto is the large Chip foundry in the CN, providing close collaboration whole world customers and the assurance that intellectual property is protected and respected.

Pluto was known as PLUTOSEMI, a famous substrate manufacturer and a solution provider, and has been operating for 10+ years. Our Chip foundry provide 6” (150mm) and 8” (200mm) wafer line. we have 300 state-of-the-art semiconductor processing tools has marked a key milestone in our chip Foundry transformation. It has expanded Pluto’s capability to develop and manufacture sophisticated microdevices, biochips and sensors.
 
Have your custom products outgrown the university environment, or do you require a level of customization at lower volumes that is not always supported in pure-play semiconductor foundries? Our team of experienced process engineers can help you manufacture your custom projects on 150- or 200-mm wafer diameters. We offer core competencies in the following areas:
· CMOS
· Bipolar-CMOS-DMOS (BCD)
· Embedded Nonvolatile Memory (eNVM)
· Silicon-on-Insulator (SOI) high-voltage technologies
· Charge Coupled Devices (CCDs)
· Micro-Electrical Mechanical Systems (MEMS)

The semiconductor BCD (Bipolar-CMOS-DMOS) process is an integrated circuit manufacturing technology that integrates three different types of transistors—bipolar transistors (Bipolar), complementary metal-oxide-semiconductors (CMOS), and double diffused metal-oxide-semiconductors (DMOS)—onto a single chip. This process combines the high current driving capability of bipolar transistors with the low power consumption characteristics of CMOS circuits, as well as the high voltage and large current handling capabilities of DMOS devices.
 
The main features and applications of the BCD process are as follows:
1、Bipolar transistors (Bipolar): Used in analog circuits and high current applications because they can provide higher current gain.
2、Complementary metal-oxide-semiconductors (CMOS): Used in digital logic circuits due to their low power consumption and high integration.
3、Double diffused metal-oxide-semiconductors (DMOS): Used in power electronic devices, such as high voltage or large current switches, because they can handle higher voltages and currents.

The key advantages of the BCD process include:
1、Versatility: Multiple functions, such as analog, digital, and power circuits, can be integrated on the same chip.
2、Energy efficiency: By combining the advantages of bipolar transistors and CMOS, it achieves circuit designs with higher energy efficiency.
3、Integration: High integration reduces the chip area and lowers costs.
4、Performance: It can provide high current driving capability and the ability to handle high voltages.

The BCD process is widely used in the following fields:
1、Automotive electronics: Power management, motor control, body electronics, and entertainment systems in cars.
2、Consumer electronics: Power management in smartphones, tablets, and other portable devices.
3、Industrial applications: Industrial automation, power electronics, and control systems.
As technology advances, the BCD process is also evolving, with developments like BCD5, BCD6, etc., offering higher voltage and power handling capabilities, as well as improved performance and energy efficiency.

 
● Available                        ★Indude SOI Process
Tech. BCD HV CMOS Mixed-Signal Logic e-NVM
0.13μm/0.11μm ●     ● ●
0.18μm/0.153μm ● ● ● ● ●
0.25μm ●   ●    
0.35μm     ● ● ●
0.5μm ● ★ ● ● ● ●
>0.5μm   ● ● ●  
>1.0μm   ● ● ●  
MEMS Pressure sensor,Microphone sensor,Photoelectric MEMS and Thermopiles sensor are available.
Accelerometer,Gas sensorand Micro-mirrorare under development.
Special Device APD/SPAD are underdevelopment.
 
★Advanced  BCD  Available       ▲Advanced BCD Developing       ●HV /UHV BCDAvailable       ⊙Include SOI Process
  0.11μm 0.153μm 0.18μm 0.25μm  0.5μm 0.8μm  1.0μm
12V ★ ★ ★ ★      
18V ★ ★ ★ ★      
24V ★ ★ ★ ★      
30V ★ ★ ★ ★      
40V   ★ ★ ★   ● ●
60V     ★ ★      
80V     ★        
120V     ★   ●⊙    
200V     ▲   ●⊙ ● ●
600V         ●⊙ ● ●
700V       ●   ● ●
1200V           ●  








Sales Engineer：Lance Xie
Phone：+86 138 2505 8605
Email：sales@plutosemi.com



Global Micro/Nano Foundry Services | One-Stop Semiconductor Fabrication from Prototyping to Volume Production

Unmatched Process Capabilities
◼ Lithography Suite
• Laser Direct Write (300nm to 5μm) | DUV Steppers (0.35μm) | Nanoimprint
• <50nm LWR Control | ≤100nm Overlay Accuracy

◼ Critical Thin Film Deposition
✓ PECVD (SiNx/SiO₂) ✓ ALD (High-k/2D Materials)
✓ LPCVD (Poly-Si/Si₃N₄) ✓ ICP-CVD (Low-Temp Stacks)

◼ Advanced Etching Technologies
→ ICP Etching (Si/III-V) → DRIE (100:1 Aspect Ratio)
→ XeF₂/Gas Phase HF (Isotropic Si) → IBE (Magnetic Materials)
→ RIE (CMOS Compatible) → Atomic Layer Etching (Å-level Precision)

◼ Sub-100nm Fabrication Modules
• Ion Implantation (10keV-200keV) • RTP Spike Annealing (20ms)
• Metal Lift-off • Electroplating (Cu/RDL)

Strategic Global Partnerships

Seamless Process Transfer to Major Foundries:
[ TSMC ] [ SMIC ] [ GlobalFoundries ] [ Hua Hong ] [ Huarun ]
✓ Qualify designs with us → Scale production at Tier-1 fabs
✓ Shared PDKs for 180nm/55nm BCD, RF-SOI, MEMS platforms
 


Why Choose Our Foundry?

1. Cross-Node Fabrication Flexibility
• R&D Prototyping: 10μm microfluidics to 28nm test chips
• Volume Scaling: 200mm wafer batches (ISO Class 5 cleanroom)
• Exotic Materials: GaN-on-Si | Glass interposers | Flexible hybrid electronics

2. Time-to-Market Accelerators
▶ 72-hour tape-out cycle for MPW shuttles
▶ 40% lower NRE costs vs. traditional fabs
▶ Pre-qualified process libraries:
  • MEMS: Release etching | Cavity sealing
  • Photonics: Grating couplers | Edge polishing
  • Power: Trench MOSFETs | GaN HEMTs
3. Intellectual Property Fortress
• ITAR-compliant data handling • Secure FTP design transfer
• On-site NDAs with EU/US legal frameworks
 

Target Applications Driving Global Innovation
Region Key Sectors Our Solutions
North America Quantum chips · AR/VR optics 28nm SOI test vehicles · Metasurfaces
EU Automotive MEMS · Medical implants ASIL-D sensors · Biocompatible packaging
Japan/Korea Display microdrivers · Power modules μLED transfer · SiC trench etching
Southeast Asia Advanced packaging · IoT sensors Fan-out RDL · Ultra-low power RF SoC
 
Ready to Accelerate Your Silicon Journey?
[ Request Custom Process Flow ]
[ Download PDK for 180nm BCD ]
[ Schedule Virtual Fab Tour ]

1. Keyword Mapping
  • Primary: "semiconductor foundry services", "ASIC prototyping", "MEMS fabrication"
  • Regional: "GaN fab Europe", "RF SOI tape-out Asia", "medical device foundry USA"
  • Long-tail: "low volume IC production", "28nm MPW shuttle cost"
  •  

 
 
PlutoSemi Co., Ltd.
Leading Supplier of Semiconductor Material Solutions
Phone：+86 138 2505 8605

Mobile：+86 159 8906 6199

Email：sales@plutosemi.com

Address：1815, Bldg 3, Yiyun Land Centre, No.26 Guilan North Rd, Nanhai Dist, Foshan City

Factory Address： Bldg 3, No.46, KeyuanXi Rd, Waihai Dist, Jiangmen City
Sub 1: PlutoChip Co., Ltd    -Discrete Devices and Integrated Circuits-    www.plutochip.com
Sub 2: PlutoSilica Co., Ltd   -Silicon Wafer and Glass Wafer Manufactory-
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