中文 | En
Products
Position: Home > Products > Products > Compound Wafer
Compound Wafer
LiTaO3
Lithium tantalate (LiTaO3) crystal is an excellent multifunctional material with high application value. LiTaO3 crystal has become the best choice of pyroelectric infrared detector materials due to its stable and high chemical properties (insoluble and water), Curie point higher than 600℃, not easy to depolarization phenomenon, low dielectric loss, and high optimal detection rate. The polished LT wafer is widely used in the manufacture of resonators, filters, transducers and other electronic communication devices, especially because of its good mechanical and electrical coupling, temperature coefficient and other comprehensive performance, it is used in the manufacture of high-frequency surface acoustic wave devices, and in many high-end communication fields such as mobile phones, walkie-talkies, satellite communications, aerospace and so on.
Download PDF
Product Detail
Fe doped LT Wafers
Parameter Specification
Material LiTaO3 wafers(White or Black &Fe doped)
Diameter 3inch/4inch/6inch
Diameter Tolerance ±0.03mm
Curie Temp 603±2℃
Cutting Angle X/Y/Z/X112Y/Y36/Y42/Y48/etc
Tol(±) <0.20 mm 
Thickness 0.18 ~ 0.5mm or more
Primary Flat 22mm /32mm /42.5mm /57.5mm
LTV (5mmx5mm) <1µm
TTV <3µm
BOW -30
WARP <40µm
PLTV(<0.5um) ≥95%(5mm*5mm)
Orientation Flat All available
Surface Type Single Side Polished(SSP) /Double Sides   Polished(DSP)
Polished side Ra <0.5nm
Back Side Criteria General is 0.2-0.5µm or as customized
Edge Criteria R=0.2mm or Bullnose
Fe doped Fe doped for saw grade LN< wafers
Wafer Surface Criteria Transmissivity       general:5.9x10-11-10 at 25℃
Contamination       None
Particles @>0.3 µm  ≤30
Scratch , Chipping   None
Defect              No edge cracks, scratches, saw marks, stains
Packing 25pcs per box

Optical Grade Lithium Tantalate Wafers

Parameter Specification
Material LiTaO3 wafers(White or Black)
Diameter 2inch/3inch/4inch
Diameter Tolerance ±0.03mm
Curie Temp 603±2℃
Cutting Angle X/Y/Z etc.
Tol(±) <0.20 mm 
Thickness 0.18 ~ 0.5mm or more
Primary Flat 16mm/22mm /32mm
TTV <3µm
BOW -30
WARP <40µm
Surface Type Single Side Polished(SSP) /Double Sides   Polished(DSP)
Polished side Ra <0.5nm
Back Side Criteria General is 0.2-0.5µm or as customized
Edge Criteria R=0.2mm or Bullnose
Optical doped Zn/MgO etc.
Wafer Surface Criteria Contamination       None
Particles @>0.3 µm  ≤30
Scratch , Chipping   None
Defect              No edge cracks, scratches, saw marks, stains
Packing 25pcs per box

SAW Grade Lithium Tantalate Wafers

Parameter Specification
Material LiTaO3 wafers
Diameter 3inch/4inch/6inch
Diameter Tolerance ±0.03mm
Curie Temp 603±2℃
Cutting Angle X/Y/Z/X112Y/Y36/Y42/Y48/etc.
Tol(±) <0.20 mm 
Thickness 0.18 ~ 0.5mm or more
Primary Flat 22mm /32mm /42.5mm /57.5mm
LTV (5mmx5mm) <1µm
TTV <3µm
BOW -30
WARP <40µm
PLTV(<0.5um) ≥95%(5mm*5mm)
Orientation Flat All available
Surface Type Single Side Polished(SSP) /Double Sides Polished(DSP)
Polished side Ra <0.5nm
Back Side Criteria General is 0.2-0.5µm or as customized
Edge Criteria R=0.2mm or Bullnose
Wafer Surface Criteria Transmissivity       general:5.9x10-11-10 at 25℃
Contamination       None
Particles @>0.3 µm  ≤30
Scratch , Chipping   None
Defect              No edge cracks, scratches, saw marks, stains
Packing 25pcs per box

Sub 1: PlutoChip Co., Ltd    -Discrete Devices and Integrated Circuits-    www.plutochip.com
Sub 2: PlutoSilica Co., Ltd   -Silicon Wafer and Glass Wafer Manufactory-
Copyright © 2020 | PlutoSemi Co., Ltd | All Rights Reserved